12.18.2020 - IEDM 2020 Marks Key Process and Packaging Innovations by Intel

p>Robert Chau Intel Senior Fellow Director, Components Research By Robert Chau The International Electron Devices Meeting (IEDM), hosted every year since 1954 by the Institute of Electrical and Electronics Engineers (IEEE), is undoubtably the world’s premier conference for breakthrough semiconductor technologies. Intel researchers made 19 presentations at this week’s IEDM 2020, demonstrating breakthroughs in various …... - View Press Release - Visit Intel Corporation