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02.11.2020 - Up Close with Lakefield – Intel’s Chip with Award-Winning Foveros 3D Tech



View Intel-Press related news. p>The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with …...

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NID: 78917 / Submitted by: The Zilla of Zuron
Categories: Press Release
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