02.11.2020 - Up Close with Lakefield – Intel’s Chip with Award-Winning Foveros 3D Tech

	p>The fingernail-size Intel chip with Foveros technology is a first-of-its kind. With Foveros, processors are built in a totally new way: not with the various IPs spread out flat in two dimensions, but with them stacked in three dimensions. Think of a chip designed as a layer cake (a 1-millimeter-thick layer cake) versus a chip with …... - View Press Release - Visit Intel Corporation