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08.20.2018 - Intel’s Mix and Match Innovation (Infographic)



View Intel-Press related news. p>Today, at the annual Hot Chips Conference in Cupertino, California, Intel presented details about the company’s EMIB (Embedded Multi-die Interconnect Bridge) packaging technology.┬áDeveloped by Intel, EMIB facilitates high-speed communication between multiple die in-package, and is a key component of Intel’s mix-and-match heterogeneous computing strategy. EMIB is used in Intel® Stratix® 10 FPGAs and 8th Gen …...

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Categories: Press Release
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