Make Homepage | Add To Favorites | Print Page | Submit News | Feedback | Contact | 

Your Technical Computer Information Resource!  
     

  Technical Updates @ TACKtech Corp.  

05.05.2008 - Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition



View Intel-Press related news. May 5, 2008 – Intel Corporation, Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.

- View Press Release
- Visit Intel Corporation

NID: 21752 / Submitted by: The Spirit of Zuron
Categories: Press Release
Most recent Intel-Press related news.
Ultraportable Gaming
Intel Achieves AWS High Performance Computing Competency Status
Intel Launches SSD for Everyday Computing, Mainstream Gaming
Mobileye, Transdev ATS and Lohr Group To Develop AV Shuttles
Intel’s Thunderbolt Tech Turns 10
View archive of Intel-Press related news.
  Popular Tech News  
  Most Viewed News  
  Top Affiliates  
.....