12.346.2006 - AMD and IBM Detail Early Results Using Immersion and Ultra Low-K in 45NM Chips

San Francisco, CA. -- December 12, 2006 --At the International Electron Device Meeting (IEDM) today, IBM (NYSE: IBM) and AMD (NYSE: AMD) presented papers describing the use of immersion lithography, ultra-low-K interconnect dielectrics, and multiple enhanced transistor strain techniques for application to the 45nm microprocessor process generation.... - View Press Release - Visit AMD (Advanced Micro Devices, Inc.)