|
|
|
LEIXLIP, Ireland, June 14, 2004 - Intel Corporation's newest high-volume wafer fabrication facility has commenced production. Fab 24, a $2 billion facility, features 300 mm wafer manufacturing based on Intel's leading 90 nanometer (nm) process technology.
|
|
|
Full View / NID: 3124 / Submitted by: TACKtech Team
|
|
|
SANTA CLARA, Calif., June 14, 2004 - Intel Corporation today cut costly red tape for enterprise server OEMs with the formation of a program to precertify server platforms based on Intel® architecture processors with the offerings of major hardware and software vendors.
|
|
|
Full View / NID: 3123 / Submitted by: TACKtech Team
|
|
|
DALIAN, China, June 9, 2004 -- Intel Corporation Vice President and the General Manager of Sales and Marketing Group Asia Pacific region John Antone today announced agreements with the Dalian and Chengdu municipal governments to install innovative new technologies for delivering broadband wireless capabilities to the Chinese cities.
|
|
|
Full View / NID: 3101 / Submitted by: TACKtech Team
|
|
|
SHANGHAI, China, June 8, 2004 - Working to develop the next generation of interactive entertainment solutions for the burgeoning online industry in China, Intel Corporation and Shanda Networking today signed a Memorandum of Understanding (MOU) to cooperate on software development for the digital home. The MOU outlines efforts the companies will undertake to advance interactive gaming and digital entertainment in the home.
|
|
|
Full View / NID: 3089 / Submitted by: TACKtech Team
|
|
|
DESIGN AUTOMATION CONFERENCE, SAN DIEGO, Calif., June 7, 2004 - IBM and Intel Corporation today announced their collaboration on a new Linux-based mobile workstation pilot designed to increase the productivity of engineers working in one of today's most demanding computing fields -- Electronic Design Automation (EDA). The new platform combines the strengths of Intel® Centrino™ mobile technology, IBM ThinkPad notebooks and Cadence Design Systems software.
|
|
|
Full View / NID: 3080 / Submitted by: TACKtech Team
|
|
|
Intel’s Earnings Releases and Business Update press releases contain certain forward-looking statements (see Business Outlook) that are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements. Such risks and uncertainties include, but are not limited to, the Risk Factors noted in the Earnings Releases, Business Updates and Intel's filings with the Securities and Exchange Commission on, e.g., Form 10-K and Form 10-Q.
|
|
|
Full View / NID: 3063 / Submitted by: TACKtech Team
|
|
|
COMPUTEX, TAIPEI, Taiwan, June 2, 2004 -- Intel Corporation today announced that three of its recently introduced processors are now available to support communications infrastructure, multimedia and products for other embedded market segments. Today's announcement helps accelerate the industry's move to modular standards-based building blocks by providing a wide range of technologies that serves as the foundation for more innovative, cost-effective embedded applications.
|
|
|
Full View / NID: 3053 / Submitted by: TACKtech Team
|
|
|
SANTA CLARA, Calif., June 1, 2004 - Intel Corporation announced it is working with CollabNet to release Foundation code of Intel's next-generation firmware technology under the Common Public License (CPL) later this year.
|
|
|
Full View / NID: 3041 / Submitted by: TACKtech Team
|
|
|
SANTA CLARA, Calif., June 1, 2004 - Intel Corporation today introduced four mobile processors for the portability and value market segments. Today's launch ushers in the second generation Mobile Intel® Pentium® 4 Processor based on Intel's industry-leading high-volume 90-nanometer (nm) process technology and expands the company's Intel® Celeron® M Processor family.
|
|
|
Full View / NID: 3040 / Submitted by: TACKtech Team
|
|
|
SANTA CLARA, Calif., May 27, 2004 - To support its ongoing commitment to transparency and accountability, Intel Corporation has published its third annual report on its corporate social responsibility efforts. The goal of the newly released Global Citizenship report is to offer a balanced and reasonable presentation of Intel's economic, environmental, health and safety, and social performance in 2003 and to outline the company's priorities and commitments in this arena for the future. The report also illustrates Intel's long-standing approach to being a good neighbor in the communities in which it operates.
|
|
|
Full View / NID: 3010 / Submitted by: TACKtech Team
|
|
|
Intel® Itanium® 2-Processor-Based SGI® Altix® Servers Help Propel Procter & Gamble Productivity And Innovation
SANTA CLARA, Calif. and MOUNTAIN VIEW, Calif., May 24, 2004 - Intel Corporation and SGI today announced that the Procter & Gamble Company has recently doubled its deployment of Intel® Itanium® 2-processor-based SGI® Altix® systems used in the manufacturing and packaging design of some of its most popular consumer products. The products include Folgers* coffee, Charmin* bath tissue, Bounty* paper towels, and Pampers* diapers.
|
|
|
Full View / NID: 2967 / Submitted by: TACKtech Team
|
|
|
SANTA CLARA, Calif., May 19, 2004 - Under an agreement with the Irish Development Authority (IDA), Intel Corporation today disclosed plans for an additional $2 billion investment in its facilities in Ireland. The company plans to make this investment to enable 65 nanometer (nm) process technology and build Fab 24-2 on the Ireland campus.
|
|
|
Full View / NID: 2942 / Submitted by: TACKtech Team
|
|
|
PORTLAND, Ore., May 14, 2004 - Three teens today won $50,000 scholarships at the Intel International Science and Engineering Fair (Intel ISEF) for projects exploring the ocean floor for clues on the earth's origin, computer science research that could lead to greatly enhanced computer graphics, and an inexpensive, scanning tunneling microscope.
|
|
|
Full View / NID: 2915 / Submitted by: TACKtech Team
|
|
|
SANTA CLARA, Calif., May 10, 2004 - Intel Corporation is shipping three new Intel® Pentium® M processors, boosting the performance of Intel® Centrino™ mobile technology to enhance the way people work, play and communicate without wires. The new chips are the first mobile processors built on Intel's 90-nanometer (nm) manufacturing technology, and feature faster clock speeds, design enhancements and more on-die cache memory for better performance.
|
|
|
Full View / NID: 2873 / Submitted by: TACKtech Team
|
|
|
PORTLAND, Ore., May 10, 2004 - The next generation of brilliant thinkers arrive in Portland, Ore., today armed with research they hope will improve the lives of people around the world.
|
|
|
Full View / NID: 2872 / Submitted by: TACKtech Team
|
|
|
CARY, N.C. & SANTA CLARA, Calif., May 4, 2004 - SAS and Intel Corporation today announced the immediate availability of SAS®9 on Intel-based servers and clients. Intel's joint effort with SAS expands on years of collaboration between the two companies and will help users expand business intelligence throughout the enterprise by using SAS 9 running on Intel® Itanium® 2 processor-based servers and Intel® Centrino™ mobile technology-based notebooks.
|
|
|
Full View / NID: 2843 / Submitted by: TACKtech Team
|
|
|
Intel intends to "hit it out of the park" when it introduces three new mobile processors in an event at one of the United States' newest wireless hotspots: SBC Park, home of Major League Baseball's San Francisco Giants. Intel will also discuss the growing use of Intel® Centrino™ mobile technology-based notebooks among consumers with demonstrations of the exciting new mobile consumer services and capabilities and presentations by major computer retailers.
|
|
|
Full View / NID: 2822 / Submitted by: TACKtech Team
|
|
|
SANTA CLARA, Calif., May 3, 2004 - Intel Corporation today introduced a 10-Gbps Ethernet (10GbE) adapter for servers that helps overcome for the first time the cost and technical barriers that have previously made 10GbE server connectivity impractical for the data center.
|
|
|
Full View / NID: 2821 / Submitted by: TACKtech Team
|
|
|
SANTA CLARA, Calif., April 21, 2004 - Intel Corporation today announced that it has begun a $2 billion construction project to convert a 200mm wafer fabrication facility to a state-of-the-art 300mm facility in Chandler, Ariz. The conversion of Fab 12 is scheduled to be completed in late 2005. The converted facility will begin initial production on 65-nanometer process technology.
|
|
|
Full View / NID: 2743 / Submitted by: TACKtech Team
|
|
|
INTEL DEVELOPER FORUM, BARCELONA, Spain, April 21, 2004 - Intel Corporation today announced that its venture investing organization, Intel Capital, has made four new investments in companies developing innovative technologies for the digital home.
|
|
|
Full View / NID: 2742 / Submitted by: TACKtech Team
|
|
; void('');){kind=link}
