Make Homepage | Add To Favorites | Print Page | Submit News | Feedback | Contact | 

Your Technical Computer Information Resource!  
     
  Technical Updates @ TACKtech Corp.  

11.03.2005 - AMD Applauds Agreement To Eliminate Duties On Multi-Chip Package (MCP) Semiconductors



View AMD related news. AMD (NYSE:AMD) today announced support for the draft agreement finalized at the Governments/Authorities Meeting on semiconductors (GAMS) in Seoul, Korea that is intended to eliminate duties on multi-chip package integrated circuits beginning on January 1, 2006. MCPs combine multiple pieces of silicon within a single package, and are used in a variety of products from cell phones to personal digital assistants.

- View Press Release
- Visit AMD (Advanced Micro Devices, Inc.)

NID: 8405 / Submitted by: Megan
Categories: Press Release
Most recent AMD related news.
AMD to Host Annual Meeting of Stockholders
2nd Generation AMD Ryzen™ Desktop Processors Deliver Best-in-Class Compute Performance and Even Faster Gaming Framerates than Previous Generation
AMD to Report Fiscal First Quarter 2018 Financial Results
AMD Named Company of the Year at PCR Awards 2018
AMD is Proud to Present a Multi-Year Partnership with Scuderia Ferrari
View archive of AMD related news.

Visit the TACKtech Shop
  Popular Tech News  
  Most Viewed News  
  Top Affiliates  
........