Make Homepage | Add To Favorites | Print Page | Submit News | Feedback | Contact | 

Your Technical Computer Information Resource!  
     
  Technical Updates @ TACKtech Corp.  

11.03.2005 - AMD Applauds Agreement To Eliminate Duties On Multi-Chip Package (MCP) Semiconductors



View AMD related news. AMD (NYSE:AMD) today announced support for the draft agreement finalized at the Governments/Authorities Meeting on semiconductors (GAMS) in Seoul, Korea that is intended to eliminate duties on multi-chip package integrated circuits beginning on January 1, 2006. MCPs combine multiple pieces of silicon within a single package, and are used in a variety of products from cell phones to personal digital assistants.

- View Press Release
- Visit AMD (Advanced Micro Devices, Inc.)

NID: 8405 / Submitted by: Megan
Categories: Press Release
Most recent AMD related news.
Ryzen™ PRO Desktop Solutions Gain Exceptional Support from World’s Largest Commercial PC Suppliers
AMD and Baidu Join Forces to Advance GPU Computing in the Datacenter with Radeon Instinct MI Series
AMD EPYC™ Momentum Grows with Datacenter Commitments from Tencent and JD.com, New Product Details from Sugon and Lenovo
Radeon™ RX Vega Graphics Cards and Radeon™ Packs: Next Generation Enthusiast Gaming, Available Now
AMD Launches the Highest-Performance Desktop Processor, Ever, with Ryzen™ Threadripper™ High End Desktop Processors
View archive of AMD related news.

Visit the TACKtech Shop
  Popular Tech News  
  Most Viewed News  
  Top Affiliates  
........