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11.03.2005 - AMD Applauds Agreement To Eliminate Duties On Multi-Chip Package (MCP) Semiconductors



View AMD related news. AMD (NYSE:AMD) today announced support for the draft agreement finalized at the Governments/Authorities Meeting on semiconductors (GAMS) in Seoul, Korea that is intended to eliminate duties on multi-chip package integrated circuits beginning on January 1, 2006. MCPs combine multiple pieces of silicon within a single package, and are used in a variety of products from cell phones to personal digital assistants.

- View Press Release
- Visit AMD (Advanced Micro Devices, Inc.)

NID: 8405 / Submitted by: Megan
Categories: Press Release
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