Make Homepage | Add To Favorites | Print Page | Submit News | Feedback | Contact | 

Your Technical Computer Information Resource!  
     
  Technical Updates @ TACKtech Corp.  

11.03.2005 - AMD Applauds Agreement To Eliminate Duties On Multi-Chip Package (MCP) Semiconductors



View AMD related news. AMD (NYSE:AMD) today announced support for the draft agreement finalized at the Governments/Authorities Meeting on semiconductors (GAMS) in Seoul, Korea that is intended to eliminate duties on multi-chip package integrated circuits beginning on January 1, 2006. MCPs combine multiple pieces of silicon within a single package, and are used in a variety of products from cell phones to personal digital assistants.

- View Press Release
- Visit AMD (Advanced Micro Devices, Inc.)

NID: 8405 / Submitted by: Megan
Categories: Press Release
Most recent AMD related news.
AMD And Alienware Team Up With The New Film "ASSASSIN'S CREED" To Create A Movie Virtual Reality Experience
AMD to Showcase "Summit Ridge" "Zen"-based CPU at New Horizon Live Event
AMD Radeon Technology Will Be Available on Google Cloud Platform in 2017
AMD Releases New Version of ROCm, the Most Versatile Open Source Platform for GPU Computing
AMD Announces Availability of Radeon Pro WX Series Graphics Cards
View archive of AMD related news.

Visit the TACKtech Shop
  Popular Tech News  
  Most Viewed News  
  Top Affiliates  
........