Make Homepage | Add To Favorites | Print Page | Submit News | Feedback | Contact | 

Your Technical Computer Information Resource!  
     
  Technical Updates @ TACKtech Corp.  

09.12.2005 - Spansion Introduces Innovative Package-On-Package Solution To Reduce Wireless Device Size



View AMD related news. Spansion LLC, the Flash memory venture of AMD (NYSE:AMD) and Fujitsu Limited (TSE:6702), today announced it is shipping Package-on-Package (PoP) Flash memory samples to customers that will enable them to deliver sleek, feature-rich wireless phones, PDAs, digital cameras and MP3 players. Spansion’s new PoP solution vertically combines discrete logic and memory packages for board space savings, lower pin-count, simplified system integration and enhanced performance. As a result, handset manufacturers can accommodate the growing demand for advanced features in their wireless products without having to increase their size and weight.

- View Press Release
- Visit AMD (Advanced Micro Devices, Inc.)

NID: 7854 / Submitted by: Megan
Categories: Press Release
Most recent AMD related news.
AMD to Host EPYC™ One Year Anniversary Webinar
AMD Engineer Gabriel Loh Named 2018 Maurice Wilkes Award Winner for Outstanding Contributions to Die-Stacked Architectures
AMD EPYC™ to Power New HPE Gen10 No Compromise Single-Socket Server to Redefine Virtualization and Software-Defined Storage
Pushing Boundaries for CPUs and GPUs, AMD Shows Next-Generation of Ryzen, Radeon and EPYC Product Leadership at Computex 2018
Radeon FreeSync™ Technology Brings Smooth Gaming to the Big Screen: Introducing FreeSync™ technology for New Samsung QLED TVs
View archive of AMD related news.

Visit the TACKtech Shop
  Popular Tech News  
  Most Viewed News  
  Top Affiliates  
........