Make Homepage | Add To Favorites | Print Page | Submit News | Feedback | Contact | 

Your Technical Computer Information Resource!  
     
  Technical Updates @ TACKtech Corp.  

07.09.2019 - Intel Unveils New Tools in Its Advanced Chip Packaging Toolbox



View Intel-Press related news. p>What’s New: This week at SEMICON West in San Francisco, Intel engineering leaders provided an update on Intel’s advanced packaging capabilities and unveiled new building blocks, including innovative uses of EMIB and Foveros together and a new Omni-Directional Interconnect (ODI) technology. When combined with Intel’s world-class process technologies, new packaging capabilities will unlock customer innovations and deliver the …...

- View Press Release
- Visit Intel Corporation

NID: 77642 / Submitted by: The Zilla of Zuron
Categories: Press Release
Most recent Intel-Press related news.
Intel Launches Immersive Highlights with Manchester City Giving Sports Fans New Perspectives
Intel Ships Stratix 10 DX FPGAs; VMware Among Early Partners
Intel Promotes Two Corporate Officers
Oracle and Intel Collaborate on Optane DC Persistent Memory Performance Breakthroughs in Next-Generation Oracle Exadata X8M
Intel Drives Visual Cloud Innovation at IBC2019
View archive of Intel-Press related news.

Visit the TACKtech Shop
  Popular Tech News  
  Most Viewed News  
  Top Affiliates  
........