Make Homepage | Add To Favorites | Print Page | Submit News | Feedback | Contact | 

Your Technical Computer Information Resource!  
     
  Technical Updates @ TACKtech Corp.  

07.06.2005 - Intel and Corning Enter Joint Development Agreement for Extreme Ultraviolet Photomask Substrates



View Intel-Press related news. CORNING, N.Y., July 6, 2005 €“ Intel Corporation and Corning Incorporated (NYSE:GLW) have entered into an agreement to develop ultra low thermal expansion ULE® glass photomask substrates required for Extreme Ultraviolet (EUV) lithography technology. These substrates are needed to develop low defect EUV photomasks to enable 32nm node high-volume production using EUV lithography.

- View Press Release
- Visit Intel Corporation

NID: 7401 / Submitted by: The Spirit of Zuron
Categories: Press Release
Most recent Intel-Press related news.
Intel Unveils New Intel Responsive Retail Platform and Plans for $100 Million Investment at NRF 2017
Technology Will Transform the Shopping Experience
Tom Brady Stars in Intel Commercial Airing During Super Bowl LI
Intel Technology at the Heart of Week’s News
The High-Flying and the Amazing Dominate Intel’s Booth
View archive of Intel-Press related news.

Visit the TACKtech Shop
  Popular Tech News  
  Most Viewed News  
  Top Affiliates  
........