Make Homepage | Add To Favorites | Print Page | Submit News | Feedback | Contact | 

Your Technical Computer Information Resource!  
  Technical Updates @ TACKtech Corp.  

07.06.2005 - Intel and Corning Enter Joint Development Agreement for Extreme Ultraviolet Photomask Substrates

View Intel-Press related news. CORNING, N.Y., July 6, 2005 €“ Intel Corporation and Corning Incorporated (NYSE:GLW) have entered into an agreement to develop ultra low thermal expansion ULE® glass photomask substrates required for Extreme Ultraviolet (EUV) lithography technology. These substrates are needed to develop low defect EUV photomasks to enable 32nm node high-volume production using EUV lithography.

- View Press Release
- Visit Intel Corporation

NID: 7401 / Submitted by: The Spirit of Zuron
Categories: Press Release
Most recent Intel-Press related news.
Intel Capital Announces $38M of New Investments in 12 Technology Startups to Kick Off Annual Global Summit
Intel to Feature Future Payment Solutions at Money 20/20
Intel Brings Tomorrow’s Payment Solutions to Market at Money 20/20
Intel Celebrates Women in Technology at Grace Hopper Conference
Intel’s Diane Bryant Speaks at Fortune Most Powerful Women Summit
View archive of Intel-Press related news.

Visit the TACKtech Shop
  Popular Tech News  
  Most Viewed News  
  Top Affiliates