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03.02.2009 - Intel, TSMC Reach Agreement to Collaborate on Technology Platform, IP Infrastructure, SoC Solutions



View Intel-Press related news. Santa Clara, CA & Hsin-chu, Taiwan, March 2, 2009 - Intel Corporation and TSMC today announced a memorandum of understanding (MOU) to collaborate on addressing technology platform, intellectual property (IP) infrastructure, and System-on-Chip (SoC) solutions.

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NID: 27246 / Submitted by: The Zilla of Zuron
Categories: Press Release
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