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01.15.2009 - AMD Offers New Package Features for Embedded Markets

View AMD related news. AMD (NYSE: AMD) today announced immediate availability of the AMD Sempron™ 210U and 200U processors for embedded systems. These new processors are available with five year longevity that is standard for AMD embedded components and feature lidless Ball Grid Array (BGA) packaging with the low power and high performance of AMD's Direct Connect Architecture.

- View Press Release
- Visit AMD (Advanced Micro Devices, Inc.)

NID: 26448 / Submitted by: The Zilla of Zuron
Categories: Press Release
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