Make Homepage | Add To Favorites | Print Page | Submit News | Feedback | Contact | 

Your Technical Computer Information Resource!  
     
  Technical Updates @ TACKtech Corp.  

01.15.2009 - AMD Offers New Package Features for Embedded Markets



View AMD related news. AMD (NYSE: AMD) today announced immediate availability of the AMD Sempron™ 210U and 200U processors for embedded systems. These new processors are available with five year longevity that is standard for AMD embedded components and feature lidless Ball Grid Array (BGA) packaging with the low power and high performance of AMD's Direct Connect Architecture.

- View Press Release
- Visit AMD (Advanced Micro Devices, Inc.)

NID: 26448 / Submitted by: The Zilla of Zuron
Categories: Press Release
Most recent AMD related news.
AMD Unveils Expanding Set of High-Performance Products and Technologies Propelling Next Phase of Growth
AMD Raises Expectations for Server Performance, Unveils EPYC Processor Brand for the Datacenter
AMD Reports First Quarter 2017 Financial Results
The New Radeon Pro Duo Delivers Professional-Grade Performance & Flexibility for Today's Most Complex Multi-Tasking Workflows
Radeon(TM) RX 500 Series: The Most Compelling Graphics Card Upgrade Yet
View archive of AMD related news.

Visit the TACKtech Shop
  Popular Tech News  
  Most Viewed News  
  Top Affiliates  
........