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05.05.2008 - Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition



View Intel-Press related news. May 5, 2008 – Intel Corporation, Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.

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NID: 21752 / Submitted by: The Spirit of Zuron
Categories: Press Release
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