Make Homepage | Add To Favorites | Print Page | Submit News | Feedback | Contact | 

Your Technical Computer Information Resource!  
     
  Technical Updates @ TACKtech Corp.  

05.05.2008 - Intel, Samsung Electronics, TSMC Reach Agreement for 450mm Wafer Manufacturing Transition



View Intel-Press related news. May 5, 2008 – Intel Corporation, Samsung Electronics and TSMC today announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012.

- View Press Release
- Visit Intel Corporation

NID: 21752 / Submitted by: The Spirit of Zuron
Categories: Press Release
Most recent Intel-Press related news.
Performance and Connectivity at Amazing Value
Facial-Recognition Technology at the Cutting Edge of Retail, High-Speed Authentication
4 Things a Non-Gamer Learned at Her 1st Intel Extreme Masters
Intel Extreme Masters Oakland Draws 28.6 Million Views, Demonstrating Continued Esports Growth
nvent: DeepLens, a Deep Learning-Enabled Wireless Video Camera Powered by Intel
View archive of Intel-Press related news.

Visit the TACKtech Shop
  Popular Tech News  
  Most Viewed News  
  Top Affiliates  
........