Make Homepage | Add To Favorites | Print Page | Submit News | Feedback | Contact | 

Your Technical Computer Information Resource!  
     
  Technical Updates @ TACKtech Corp.  

05.29.2006 - AMD To Invest Us$2.5 Billion In Germany To Expand 300mm Microprocessor Production



View AMD related news. SUNNYVALE and DRESDEN -- May 29, 2006 --AMD (NYSE: AMD) today announced that it plans to expand its microprocessor manufacturing capacity over the next three years by adding additional 300 millimeter wafer production capabilities in Dresden through the implementation of three new projects. AMD’s newest fabrication facility will come online through a major transformation of the company’s existing Fab 30, which will be named Fab 38. The transition from 200mm to 300mm allows for more than twice as many processors on a wafer. In addition, AMD will also expand Fab 36’s existing 300mm capacity and build a new clean room facility to handle the site’s growing Bump and Test requirements, which is one of the final stages of the manufacturing process where wafers are prepared to be shipped for packaging. With plans to invest a total of US$2.5 billion in the Dresden expansion projects, AMD continues to aggressively scale its innovative manufacturing processes to meet growing customer needs.

- View Press Release
- Visit AMD (Advanced Micro Devices, Inc.)

NID: 10695 / Submitted by: TACKtech Team
Categories: Press Release
Most recent AMD related news.
Baidu Deploys AMD EPYC Single Socket Platforms to Power its 'ABC' Datacenters
Introducing Radeon Software Adrenalin Edition: Amped-Up, Intuitive, Connected Gaming from AMD
AMD and Qualcomm Technologies to Support Always Connected PCs on Ryzen™ Mobile Platforms
Microsoft Azure Becomes First Global Cloud Provider to Deploy AMD EPYC™
AMD EPYC™ Processor Powers New HPE Gen10 Server to World Records in SPEC CPU® Benchmarks
View archive of AMD related news.

Visit the TACKtech Shop
  Popular Tech News  
  Most Viewed News  
  Top Affiliates  
........